Tipo: Board Level, Vertical, Paquete arrefriado: TO-220, TO-218, Método de fixación: Bolt On, Forma: Rectangular, Fins, Lonxitude: 1.500" (38.10mm), Ancho: 0.640" (16.26mm),
Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.750" (44.45mm), Ancho: 1.700" (43.18mm),
Tipo: Top Mount, Paquete arrefriado: BGA, Método de fixación: Adhesive, Forma: Square, Pin Fins, Lonxitude: 0.984" (25.00mm), Ancho: 0.984" (25.00mm),
Tipo: Top Mount, Paquete arrefriado: BGA, Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Fins, Lonxitude: 1.378" (35.00mm), Ancho: 1.378" (35.00mm),
Tipo: Top Mount, Paquete arrefriado: BGA, Método de fixación: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Lonxitude: 1.378" (35.00mm), Ancho: 1.378" (35.00mm),
