Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Clip, Thermal Material, Forma: Rectangular, Pin Fins, Lonxitude: 2.895" (73.53mm), Ancho: 2.000" (50.80mm),
Tipo: Top Mount, Paquete arrefriado: BGA, Método de fixación: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Lonxitude: 1.378" (35.00mm), Ancho: 1.378" (35.00mm),
