Disipadores térmicos

APR33-33-12CB/M

Parte Stock: 6030

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Clip, Forma: Square, Pin Fins, Lonxitude: 1.283" (32.60mm), Ancho: 1.283" (32.60mm),

APR38-38-12CB/T

Parte Stock: 6033

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Clip, Forma: Square, Pin Fins, Lonxitude: 1.461" (37.10mm), Ancho: 1.461" (37.10mm),

BDN09-3CB/A01

Parte Stock: 31224

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 0.910" (23.11mm), Ancho: 0.910" (23.11mm),

BDN10-5CB/A01

Parte Stock: 45852

BDN15-3CB/A01

Parte Stock: 37650

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.510" (38.35mm), Ancho: 1.510" (38.35mm),

BDN12-5CB/A01

Parte Stock: 26877

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.210" (30.73mm), Ancho: 1.210" (30.73mm),

BDN16-3CB/A01

Parte Stock: 16237

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.610" (40.89mm), Ancho: 1.610" (40.89mm),

BDN12-3CB/A01

Parte Stock: 28027

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.210" (30.73mm), Ancho: 1.210" (30.73mm),

BDN18-6CB/A01

Parte Stock: 18703

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.810" (45.97mm), Ancho: 1.810" (45.97mm),

BDN17-3CB/A01

Parte Stock: 24023

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.710" (43.43mm), Ancho: 1.710" (43.43mm),

BDN14-3CB/A01

Parte Stock: 28091

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.410" (35.81mm), Ancho: 1.410" (35.81mm),

BDN18-3CB/A01

Parte Stock: 18333

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.810" (45.97mm), Ancho: 1.810" (45.97mm),

BDN09-3CB

Parte Stock: 43083

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Lonxitude: 0.910" (23.11mm), Ancho: 0.910" (23.11mm),

BDN13-3CB/A01

Parte Stock: 25347

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.310" (33.27mm), Ancho: 1.310" (33.27mm),

BDN11-3CB/A01

Parte Stock: 25975

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.110" (28.19mm), Ancho: 1.110" (28.19mm),

BDN10-3CB/A01

Parte Stock: 31662

Tipo: Top Mount, Paquete arrefriado: Assorted (BGA, LGA, CPU, ASIC...), Método de fixación: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Lonxitude: 1.010" (25.65mm), Ancho: 1.010" (25.65mm),

LAT0127B2CB

Parte Stock: 6139

Tipo: Board Level, Paquete arrefriado: TO-127, TO-220, Método de fixación: Bolt On, Forma: Rhombus, Lonxitude: 1.630" (41.40mm), Ancho: 1.290" (32.77mm),

TXP0508B

Parte Stock: 2429

LA363B3CB

Parte Stock: 6143

Tipo: Board Level, Paquete arrefriado: TO-3, Método de fixación: Bolt On, Forma: Rhombus, Lonxitude: 1.630" (41.40mm), Ancho: 1.290" (32.77mm),

PSD1-1-CB

Parte Stock: 6104

Tipo: Board Level, Vertical, Método de fixación: Bolt On and PC Pin, Forma: Rectangular, Fins, Lonxitude: 2.180" (55.37mm), Ancho: 1.380" (35.05mm),

FHL31-31-17/T710/T

Parte Stock: 1941

Tipo: Board Level, Método de fixación: Clip, Tape, Forma: Square, Fins, Lonxitude: 1.220" (30.99mm), Ancho: 1.220" (30.99mm),

FXE827269T710

Parte Stock: 6236

TX30547R

Parte Stock: 4050

TX1822ND

Parte Stock: 1560

TX0547B

Parte Stock: 3746

HP3-TO3-CB

Parte Stock: 6170

Tipo: Board Level, Paquete arrefriado: TO-3, Método de fixación: Bolt On, Forma: Square, Pin Fins, Lonxitude: 3.120" (79.25mm), Ancho: 3.120" (79.25mm),

LATO3B5B

Parte Stock: 6195

RUR6712U

Parte Stock: 6221

Tipo: Board Level, Vertical, Método de fixación: Bolt On and Clip, Forma: Rectangular, Lonxitude: 0.113" (2.87mm), Ancho: 0.530" (13.46mm),

FEX40-40-21/T710/M2

Parte Stock: 2437

Tipo: Board Level, Método de fixación: Clip, Tape, Forma: Square, Fins, Lonxitude: 1.575" (40.00mm), Ancho: 1.575" (40.00mm),

RU67B1B

Parte Stock: 6136

Paquete arrefriado: TO-92, Método de fixación: Press Fit,

TX1822B

Parte Stock: 2322

TXP050822B

Parte Stock: 2302

TXB2P050037B

Parte Stock: 4114

LAE66A3CB

Parte Stock: 31599

Tipo: Board Level, Paquete arrefriado: TO-126, TO-220, Método de fixación: Bolt On, Forma: Rhombus, Lonxitude: 1.310" (33.27mm), Ancho: 0.900" (22.86mm),

LA363B4CB

Parte Stock: 6129

Tipo: Board Level, Paquete arrefriado: TO-3, Método de fixación: Bolt On, Forma: Rhombus, Lonxitude: 1.630" (41.40mm), Ancho: 1.290" (32.77mm),

LATO3B4B

Parte Stock: 9624